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STMicroelectronics has released two new Sound Terminal digital audio system -on-chips, allowing designers to achieve slimmer home entertainment applications, while also driving heat sinks, allowing products to pass strict product safety requirements.
STA381BW and STA381BWS are available in 48-pin VQFN 7 x 7 x 1mm packages, and STMicroelectronics has begun to provide main customer samples for testing.
Innovative home entertainment devices such as flat-screen TVs and music stands allow consumers to fill music in every corner of the room and achieve a more natural listening experience without having to fill the room with audio equipment. With the Sound Terminal system-on-chip, STMicroelectronics has become the market leader in a new generation of light and slim home entertainment equipment. This series of chips integrates multiple functions such as digital audio processing and speaker drive circuits. According to the latest research report from market research agency iSuppli, 30% of flat-panel TVs sold worldwide currently use ST's Sound Terminal chip.
The new products STA381BW and STA381BWS are optimized for flat-panel TVs. The monolithic integrated headphone driver, line driver output and independent digital-to-analog converter (DAC) allow designers to reduce the space on the printed circuit board. Under normal circumstances, Three additional chips are required for these functions. The chip's built-in digital-to-analog converter provides an additional analog output that connects the headphone input port to an external circuit. STMicroelectronics' F3X® technology simplifies external filter design. Headphone drivers and industry-standard 2Vpp line outputs do not require direct current (DC) isolation capacitors, which saves the use of external components and further minimizes printed circuit board size and manufacturing costs.
In addition, STA381BW and STA381BWS also have the best thermal management performance in the industry, which integrates ST's unique high-efficiency PWM control technology and enhanced packaging design, which can reduce the operating temperature and help simplify the thermal management design to ensure that the TV temperature is Product safety standards, such as UL or CE. The output power of STA381BW and STA381BWS reaches 15W (24V, 8Ω load), keeping the chip operating temperature at 55.4 ° C.
The main features of STA381BW / S:
• I2S and 1Vrms stereo analog audio output
• Configurable output power level (2.0 or 2.1 mode)
• Load drive capability:
• 2 20W 8Ω loads, ternary modulation
• 2 9W 4Ω loads + 1 20W 8Ω load
• 27V maximum power supply voltage (STA381BWS)
• 30V maximum power supply voltage (STA381BW)
As a new member of the Sound Terminal product family, these two chips integrate digital signal processing and speaker drive circuits, using STMicroelectronics' fully flexible amplification (FFX) technology. FFX integrates 2.1-channel audio processing functions and digitally controlled Class D amplifiers with energy efficiency up to 94%. The audio processor also integrates STSpeakerSafe, STCompressor and STSpeakerTune speaker compensation technology, which can improve the sound quality of flat-screen TV speakers, while preventing the speakers from being damaged due to excessive input power.
PGA Sockets Pin Grid Array Socket
A pin grid array, often abbreviated PGA, is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package.
PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP).
PGA Sockets & Adapters
Low insertion force Pin Grid Array (PGA) Sockets and Adapters are available in a variety of RoHS Compliant insulators with hundreds of screw-machined terminal choices. Virtually any PGA footprint can be accommodated, including interstitial patterns.
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RoHS compliant insulators and screw-machined terminals are compatible with lead-free processing - select either Matte Tin/Gold (MG) or Gold/Gold (GG) plating
Antenk's Pin Grid Array (PGA) Sockets
Complex printed circuits are too valuable to risk direct soldering to expensive integrated circuits (ICs). Using a socket is the answer. The use of sockets offers advantages that prove cost effective and simplify board design.
Antenk's processor socket line is designed for use with Intel- and AMD-based microprocessor packages. Socket types include land grid array (LGA), micro pin grid array (mPGA), and PGA with low to zero insertion force. The mPGA and PGA sockets are designed for various microprocessor packages for notebook PCs, desktop PCs, and servers. For custom applications, the compression sockets can be configured to the specific application.
mPGA/PGA (ZIF)These sockets provide a zero insertion force (ZIF) PGA interface to the microprocessor PGA package and are attached to the PCB with surface-mount technology (SMT) soldering. PGA sockets are available in arrays up to 989 positions with single lever, screw driver, and hex wrench actuation methods.
PGA Sockets (LIF)
These sockets are primarily employed for microprocessor package test applications using through-hole solder attachment to the PCB design. The contacts are screw-machine outer sleeves with either stamped and formed or drawn inner contacts. Custom arrays are available in more than 1,000 positions.
Pin Grid Array (PGA) Sockets Type
mPGA
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Eliminate hand-loading of pins, facilitate solder joint visibility, low profile component mounting or board mating.
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