Texas Instruments (TI) today introduced the industry's highest integrated audio codec with an embedded miniDSP core that offsets echo and noise in applications with wideband speech sampling rates up to 16 kHz. The TLV320AIC3262 is highly integrated with 5 amplifiers and 2 miniDSP cores, allowing designers to connect 3 devices simultaneously, such as applications, Bluetooth, and baseband processors. Audio speech samples can be seamlessly received, mixed and processed in the codec, and the codec is configured with both TI audio speech algorithms and third-party algorithms, and can be used as a license for designers to create on mobile devices. Multi-functional HD audio design brings great advantages.
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Key features and benefits of the TLV320AIC3262:
· Third-generation miniDSP technology offsets broadband noise and echo at frequencies up to 16 kHz, delivering high-definition voice quality for circuit-switched or VoIP telephony in applications such as video conferencing;
· SRS WOW HDTM improves audio playback quality, is a standard feature of the product without increasing customer cost, and can also improve host processing speed by offloading the host processor's tasks to the codec. Designers can also evaluate other certified pre-integrated SRS solutions, including TruMediaTM, CircleSurround HeadphoneTM, and TruSurround HDTM. The above options can be purchased through the direct license agreement of SRS Labs;
· 3 asynchronous audio buses and asynchronous sample rate conversion (ASRC) allow designers to connect multiple audio resources and configure multiple sample rates;
· Intelligent speaker protection algorithm controls voice coil temperature and diaphragm offset to maximize volume without damaging the speaker.
Availability
The TLV320AIC3262 is available now in a 4.8 mm x 4.8 mm WCSP package.
Tools and support
The TLV320AIC3262EVM-U helps designers evaluate the performance of the TLV320AIC3262. The IBIS model and the miniDSP software driver are also available.
The PurePathTM Studio Graphics Development Environment (GDE) simplifies product design through miniDSP and audio processing. GDE includes all of the algorithms from previous software releases, as well as new algorithms and enhancements specific to the TLV320AIC3262. This enhanced version of the software can run more algorithms side-by-side than previous generations.
Ensure constant high quality audio
The TLV320AIC3262 can be easily paired with TI Boost Class D speaker amplifiers such as the TPA2015, TPA2025, and TPA2080. These devices maintain a constant power output when the battery is depleted, further enhancing the various algorithms of the TLV320AIC3262 and protecting the speakers.
Designers using different digital signal processing solutions can design with the TLV320AIC3212 to take full advantage of the high integration and various features of the TLV320AIC3262 without increasing the cost of the miniDSP. The two codecs are pin-to-pin compatible and the TLV320AIC3212 user can easily upgrade to the miniDSP technology of the TLV320AIC3262.
Improve mobile device user experience
Audio is only part of the user experience. TI offers a wide range of touch screen controllers and haptic drivers to enhance the mobile experience, as well as a wide range of battery management, wireless power and portable power solutions to extend battery life.
trademark
TI E2E and PurePath Studio are trademarks of Texas Instruments. SRS WOW HD, TruSurround HD, CircleSurround Headphone, and TruMedia are trademarks of SRS Labs. All registered trademarks and other trademarks are the property of their respective owners.
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