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Consumer demand for smaller, thinner, more advanced, and more feature-rich portable electronic products is growing, and manufacturers must continue to develop more sophisticated and sophisticated next-generation technologies. In order to keep up with the technical requirements, semiconductor device suppliers are using silicon technology and the latest generation of packaging technology to maximize the integration of devices to meet the ever-changing market requirements.
This consumer demand has accelerated the convergence of functions, and more sophisticated products have integrated functions such as mobile phones, digital cameras, music players, wireless e-mail and portable video games, and have gradually become standard equipment in the market. However, this trend will be constrained if performance, cost and size do not meet the growing consumer demand for the previous generation.
The interaction between consumers and next-generation applications is driving the development of a large number of rapid technologies in the semiconductor product industry, with new technology solutions that deliver performance, time-to-market (design complexity) and cost balance. To accelerate the rapid development of the economy.
The latest highly integrated multimedia DSP/microprocessors, integrated power conversion ICs, camera imaging equipment, and data interface ICs are a range of innovative products that balance performance (battery life, functionality) and cost. In addition, packaging technology has undergone tremendous changes to provide solutions that meet space saving and higher performance requirements.
Figure 1 Power semiconductor device in a new package
Perhaps the most affected by this change in the semiconductor industry is the field of power management. As the increase in functionality directly increases static power consumption, and current battery technology development is not enough to meet the multiple functional energy requirements of today's high-energy applications, the design team must grasp all the opportunities for optimizing power management within the circuit. .
Before the next generation of higher-density portable energy sources can be put into practical use (such as cost-effective and environmentally friendly fuel cells), designers must ensure that product power consumption is minimized, and semiconductor suppliers must constantly introduce solutions. To cope with this dilemma.
Take the mobile phone in the early 1990s as an example. The product uses a 1000mAh NiMH battery and a first-generation chipset, and uses a 7-segment Digital Tube display with limited storage capacity and less than one hour of continuous calls. time. Moreover, the volume of these products is 3 to 4 times larger than current mainstream products.
However, let's look at power management circuits that implement/control digital cameras, PDA functions, high-resolution color TFT displays, and gaming consoles. The driving force comes from the integration of power circuits and the integration of space-saving packages. Old-fashioned products use hundreds of discrete components, and today's products use only a fraction of the previous components.
Let's look at an example of driving increased integration in the field of power switches. The mobile phone and portable device industries have consumed hundreds of millions of standard MOSFETs for many years. In these same circuits, analog functions are required to control these MOSFETs and save power in the circuit. Today, power switches such as Fairchild Semiconductor, such as the IntelliMAXTM family, incorporate standard power MOSFETs and integrated features to provide protection, control and power management modules in a single product. The most advanced bump and molded package technology highlights this trend of decreasing size and improving thermal performance.
Figure 2 IntelliMAX products with integrated power management solution
This integration not only supports high-level functions and corresponding power management, but also makes them a fraction of the size, weight and thickness of the previous generation. One of the main examples is IntelliMAX. This circuit uses 7 to 8 discrete components that could not be integrated into one device, making it occupy only a fraction of the board space and adopting a new thinner than 3 to 5 years ago. Packaging technology.
Semiconductor suppliers, such as Fairchild, must constantly seek every opportunity to promote highly integrated and convenient power management solutions, just as the latest IntelliMAX products are used as power switches in traditional discrete devices.
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