Highly integrated stereo class-D amplifier (NXP)

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NXP Semiconductors, an independent semiconductor company founded by Philips, today introduced the industry's first highly integrated stereo class-D amplifier, the TDA8950, for single-layer boards – delivering greater output for small, lightweight audio systems Power, better sound quality. The NXP TDA8950, a 2x150W to 170W class-D amplifier, is designed for single-layer boards to meet the needs of manufacturers with smaller designs and lower cost for greater power.

The NXP TDA8950 delivers high fidelity performance with extremely low distortion, operates over a wide voltage supply range of ±12.5V to ±40V, and has low quiescent current. The TDA8950 improves EMI performance and its unique thermal fold-back prevents music interruptions. Its exceptional performance and cost-effectiveness give OEMs the flexibility to design high-power stereo outputs, including mini/micro Hi-Fi, home theater systems, professional music speakers and public presentation systems.

Jane Paul Huyser, global product marketing manager for NXP's semiconductor audio amplifier IC product line, said: "The NXP TDA8950 stereo class-D amplifier perfectly matches the future thin audio system. Because consumers demand high quality performance and competitive price, TDA8950 with At the same time as the superior sound, its features for single-layer boards can save a lot of money. As a leader in audio amplifier technology, NXP Semiconductors TDA8950 reflects the market demand and provides customers with complete amplifier modules to help advanced The development of audio solutions accelerates time to market and enhances product performance."

Key features of the NXP TDA8950 integrated stereo class-D amplifier include:
• Fully integrated stereo SE class-D amplifier • Output power up to 2x170W
• Integrated pulse width modulation (PWM) control with re-feedback • Power supply operating range up to 85V • Superior sound with low distortion • Improved EMI radiation level of 10dB • Thermal protection with small heat sink (Thermal fold-back The mechanism ensures that no music interruption occurs even when the chip temperature is high.
• On/Off Pop Sound Suppression • High power supply noise rejection • Current clipping protection (no shutdown due to current protection caused by complex speaker loads)

Time to market NXP's 2 x170W integrated stereo class-D amplifier for the single-layer board, the TDA8950, is available now and will be available in volume from September 2008.

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