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In recent months, the automotive industry has witnessed a significant shift as leading automakers worldwide accelerate the integration of advanced driver assistance systems (ADAS) and expand their electric and autonomous vehicle strategies. This transformation has led to a surge in demand for automotive CMOS image sensors (CIS), which play a crucial role in enabling features such as lane-keeping assistance, blind-spot detection, and 360-degree camera systems.
Major players like ON Semiconductor and OmniVision, key suppliers of CIS, have been expanding their packaging and testing orders. Companies such as Shengli and Kyungwon, which have already achieved automotive certifications, have benefited directly from this trend. With order visibility extending into next year, the semiconductor supply chain is preparing for increased production.
Japanese giants Sony and Panasonic are also intensifying their efforts in the automotive CIS market. Meanwhile, Taiwan’s semiconductor manufacturing sector has made progress in securing capacity and technical approvals, positioning itself to capture more packaging and testing contracts. Traditionally, CIS was used mainly for backup cameras and dashcams, with an average of only five modules per car. However, the rise of ADAS has dramatically increased that number, with new vehicles expected to use over 20 CIS modules next year. This growth will drive expansion in both fabrication and packaging capabilities.
Leading automotive CIS suppliers, including ON Semiconductor, STMicroelectronics, Sony, and Panasonic, have adopted a “fab-lite†strategy, relying more on foundries like TSMC and UMC. The packaging and testing phases have largely moved toward subcontracting, but only a few companies have secured the necessary automotive certifications. Shengli and Kyungwon have emerged as major beneficiaries, and with higher pixel counts in CIS, package pricing is rising, boosting their revenue and profitability.
Shengli reported consolidated revenue of 1.037 billion yuan in the first half of the year, with a net profit of 206 million yuan. Despite a slight monthly decline in August, the company saw a 11.8% increase compared to the same period last year. Its iBGA packaging technology has passed AEC Q-100 Grade 2 certification and is used by major OEMs like Bosch, Denso, and Continental. The company's major clients, including ON Semiconductor and Sony, are increasing their outsourcing of CIS packaging, suggesting strong future performance.
Jingyuan Power recorded consolidated revenue of 9.712 billion yuan in the first half, with a net profit of 1.149 billion yuan. Kyungwon, meanwhile, saw a 1.1% increase in August revenue to 1.723 billion yuan, despite a 5.5% drop year-over-year. With strong orders in September, the company is optimistic about hitting 1.8 billion yuan in revenue. The third-quarter combined revenue is expected to be between 5.1 and 5.3 billion yuan, reflecting a 6–9% growth compared to the second quarter.
Kyungwon has significantly expanded its market share in the automotive chip testing sector. It has secured partnerships with STMicroelectronics, NVIDIA, and Anson US, and won a key order from Howe for automotive CIS testing. Thanks to its proprietary testing equipment, Kyungwon is achieving better gross margins. Overall, the growing demand for automotive CIS is creating a favorable environment for manufacturers like Shengli and Kyungwon, who are well-positioned to benefit from the ongoing industry transformation.
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