X Jingyuan, Shengli market sales are bullish reasons - the demand for automotive CMOS image sensors increases

In recent months, the automotive industry has seen a surge in demand for CMOS image sensors (CIS), driven by the rapid development of advanced driver assistance systems (ADAS) and the growing adoption of electric and autonomous vehicles. Major automakers, including the world’s top 10, are accelerating their deployment of ADAS features such as lane departure warning, blind spot detection, and external environment sensing, all of which rely heavily on CIS technology. This trend has significantly boosted the demand for automotive-grade CIS, with leading suppliers like ON Semiconductor, OmniVision, and others expanding their packaging and testing orders. Companies such as Shengli and Kyungwon, which have already obtained automotive certifications, have benefited directly from this shift. Their order visibility now extends into next year, with strong growth expected in the first half of the year. In addition to traditional applications like rearview cameras and dashcams, modern vehicles are incorporating more than 20 CIS modules for various ADAS functions. This increase is driving semiconductor manufacturers to expand their production capacities, either through internal fab expansions or by partnering with wafer foundries. However, many major CIS suppliers, including ON Semiconductor, Sony, and STMicroelectronics, have adopted a "fab-lite" strategy, relying more on TSMC or UMC for wafer manufacturing, while outsourcing packaging and testing to specialized firms. Currently, only a few packaging and testing companies have passed automotive-grade certifications. Shengli and Kyungwon, with their strong presence in the CIS packaging and testing market, have become key beneficiaries. As CIS pixel counts continue to rise, the average package cost is also increasing, contributing to higher revenue and profitability for these firms. Shengli reported consolidated revenue of 1.037 billion yuan in the first half of the year, with net profit attributable to the parent company reaching 206 million yuan. Despite a slight 1.4% drop in August revenue to 176 million yuan, it still showed an 11.8% year-over-year growth. The company's iBGA packaging technology has been certified to AEC Q-100 Grade 2 and is used by major automotive OEMs like Continental, Bosch, and Panasonic. According to management, Shengli's major clients, including ON Semiconductor and Sony, are increasing their CIS outsourcing, which is expected to lead to better-than-anticipated performance. Jingyuan Power posted a consolidated revenue of 9.712 billion yuan in the first half of the year, with a net profit of 1.149 billion yuan. KYEC, on the other hand, saw a 1.1% increase in August revenue to 1.723 billion yuan, although it declined 5.5% compared to the same period last year. However, with a significant increase in orders in September, the company is optimistic about its revenue potential, aiming to reach 1.8 billion yuan. Its third-quarter revenue is expected to range between 5.1 and 5.3 billion yuan, reflecting a 6–9% growth from the second quarter. KYEC has also expanded its market share in the automotive chip testing sector, securing partnerships with STMicroelectronics, NVIDIA, and Anson US in the CIS test market. Additionally, it has won a major order from Howe for automotive camera CIS testing, thanks to its proprietary testing equipment, which has improved gross margin performance.

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