Power LED lighting source package structure

The utility model comprises a substrate, a plastic casing, a collecting lens and an LED chip. The material of the substrate is a metal substrate with high thermal conductivity, preferably a copper substrate, and the shape thereof can be any shape, which is determined according to requirements, preferably a rectangle; the center of the upper surface of the substrate has a Inverting the tapered pit, the LED chip is fixed on the bottom plane of the pit, and the number of the LED chips may be one or more as needed; the plastic shell is wrapped in the middle of the substrate, and the hole is opened above the pit on the substrate and Forming a step, the concentrating lens is adhered to the step in the upper part of the plastic casing; the substrate is not all wrapped by the plastic casing, but the two ends are exposed; the material of the concentrating lens excludes the resin, and optical plastic or optical glass is used.

In addition, the present invention can also optionally apply a layer of YAG on the bottom surface of the concentrating lens to change the color or color temperature of the light. The present invention also provides a method of fabricating a semiconductor solid illumination source using the structure.


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