IC Keeps Leading in Innovation, Innovation, and Innovation

With the rapid expansion of China's integrated circuit industry, the demand for electronic materials used in semiconductor manufacturing has also surged. As a critical component in the upstream of the IC production process, these materials directly influence the quality and cost of final products. However, currently, only about 20% of China's semiconductor electronic material needs are met domestically, and most of it is limited to low-end applications. The 15th China Electronics Show, themed “Informatization to Promote Industrialization and Electronic Technology to Drive Industrial Upgrading,” will soon take place at the Shanghai New International Expo Center. Ahead of the event, a non-web correspondent interviewed Dr. Yuan Yongwen, chairman and president of Ruining High-Tech Materials (Zhangzhou) Co., Ltd., who is set to participate in the exhibition. Dr. Yuan, who previously worked at Argonne National Laboratory, Intel, and Tosoh, shared his motivation for starting a business in Ganzhou through a simple example. He explained that tungsten, an essential electronic material used in integrated circuit memories, is becoming increasingly important as China focuses on expanding its memory industry. This trend presents a significant opportunity for tungsten-based electronic materials. As one of Ruining’s key development areas, the company benefits from the region's rich tungsten resources, which help reduce operational costs. Additionally, Ruining leverages its own technological expertise to create high-value products that contribute to local development. Semiconductor sputtering targets remain a challenge with a global gap. The sputter target industry is dominated by a few multinational companies, especially in advanced VLSI chip manufacturing. Domestically, the main gaps lie in ultra-pure raw materials and the development of new materials for advanced processes. Ruining, however, has built a vertical industrial chain covering everything from raw material purification to finished target production, giving it a competitive edge. The company is actively working to close the technology gap and aims to become a leading supplier within 3–5 years. Innovation remains at the core of Ruining’s strategy. The company has secured 20 domestic and international patents, including 14 U.S. or internationally recognized ones. With 30% of its annual revenue dedicated to R&D, Ruining is investing heavily in cutting-edge projects, such as a 1.08 billion yuan initiative focused on producing PVD thin film materials for chips below 22nm. This project not only supports current industry demands but also lays the groundwork for future developments in sub-10nm processes. As third-generation semiconductor technologies emerge, competition for leadership in this field is intensifying. Ruining is already preparing for this shift, focusing on high-power device components and operating a production line for ceramic-based sapphire substrates. The company is ready to enter the third-generation market quickly if demand arises. Although third-generation semiconductors are gaining traction, silicon will continue to dominate the industry for the next decade. Ruining has strong technical reserves in silicon wafers, including 18-inch wafer production, a rare capability globally. The company also offers services for reusing old silicon wafers, further enhancing its value proposition. Ruining maintains R&D centers both in China and abroad. Its U.S. facility focuses on aligning with international standards and advanced processes, while the domestic base supports production. Dr. Yuan emphasizes that innovation and maintaining technological leadership are central to Ruining’s long-term vision.

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