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First, conventional existing packaging methods and application fields
At present, LED packaging methods include: bracket row package, chip package, and module package. These packaging methods are common and commonly used.
The bracket package is the earliest used to produce a single LED device. This is our common lead-type LED (including piranha package), which is suitable for instrument indicator lights, urban lighting projects, advertising screens, barrier pipes, traffic Indicator lights, and some products and fields that are commonly used in China.
SMD package (SMD) is a leadless package, small and thin, very suitable for keyboard display illumination of mobile phones, backlighting of TV sets, and electronic products that require illumination or indication. In recent years, patch packages have been large. With the development of size and high power, three or four LED chips can be packaged in one chip, which can be used to assemble lighting products. The module package is also a multi-chip package, which packages dozens or hundreds of LED chips on a small or high package density on an aluminum oxide or aluminum nitride substrate, and the internal connection is a hybrid type, that is, There are multiple chips in series and several parallels. This package is mainly to expand the power and use it as a lighting product. Due to the high density of the package, the module package generates a large amount of heat during application, and heat dissipation is the primary problem to solve the application. The devices produced by the above packaging method have a common feature for the production of lighting fixtures: the number of thermal resistance is large, it is difficult to produce high-quality lighting fixtures, and the connection processing requirements between the module itself and the heat sink are relatively high. . At present, all the packaging methods are to mix the yellow phosphor (YAG) and the epoxy resin in different ratios, directly point to the blue LED chip, and then heat and solidify. The advantage of this common practice is that it saves materials. The disadvantage is that it is not conducive to heat dissipation and the phosphor will also age. Because both epoxy and phosphor are not heat-conducting materials, and wrapping the entire chip will affect heat dissipation. This approach is obviously not the best solution for the manufacture of LED lighting fixtures.
At present, high-power chips produced abroad, white light chips of 0.5 watts or more are coated with a uniform layer of YAG phosphor powder on the blue chip, and the appearance is a yellow cube (except for the two gold used for welding). The pad has no phosphor. This method can improve the light efficiency compared with the conventional methods. Therefore, it is widely used in foreign countries.) It is only necessary to solder the white chip to the designed circuit board during packaging, and the coating is omitted. The process of phosphors. It has brought convenience to the lighting manufacturers, but the current domestic production chip suppliers can not mass produce such LED white light chips.
China is an early country to develop LED street lamps. It is also good for domestic use. The reason is that the country attaches importance to low-carbon economy. In 2009, China implemented 10 cities and millions of LED street lights. Many cities have experimental sections to test the feasibility of LED street lamps. China is a breakthrough in the application of street lamps, while foreign countries (Osram, Nichia, Samsung and other companies) use indoor lighting as a breakthrough. Which of these two routes has more advantages, it has not yet been seen. As far as China is concerned, LED lighting is the application direction, which is caused by the national conditions. The reason is that China's national income is low, and the cost of LED indoor lighting is high, and the people can't accept it. The use of LED street lights is the government's silver, LED street lamp manufacturers are fancy this. In fact, the working conditions of LED street lamps are more demanding and more demanding than indoor LED lighting fixtures. If quality can be achieved (heat dissipation, service life, color rendering, reliability, etc.), then it is easier to do indoor LED lighting. It is. At present, foreign LED giants are launching hundreds of models or even thousands of LED indoor lighting fixtures. The price is between US$2075 and power from several watts to 20 watts. But the packaging methods they used were all mentioned above. The only Philips company that applied phosphors to LED shades was named one of the most innovative LED lighting products of 2009.
The author believes that all LED lighting fixtures should be manufactured in multi-chip package and module package (module package is a high-density multi-chip package), and it is best to directly package the LED chip on the main body of the lamp, so that the thermal resistance The least number of passes can achieve better heat dissipation. Or the circuit body coated with copper foil on the main body of the lamp has a lower thermal resistance, and the power of the LED illumination is at least several watts, so it is used in multiple chips, and the previous packaging process is not applicable, and must be adopted. New methods and processes. It is difficult to build high-quality and highly reliable LED lamps by using a plurality of packaged LED devices to assemble LED lamps, and those skilled in the art of LED lamp manufacturing can understand this.
Second, the innovation of phosphor coating process
Phosphor coating of the module package, it is currently seen that the phosphor paste is directly coated on the chip, the phosphor of the same module is still relatively consistent, but different modules may appear in mass production. It is better to use the LED phosphor film or diaphragm for the color difference. The film and the diaphragm can be produced on a large scale. The consistency is good. The LED lamps are multi-chip packages, and the emitted light is mixed with each other. The film or film is converted to white light and its color difference can be eliminated. The requirements for film and diaphragm are:
1, can pass light, the thickness is between 0.1----0.5mm, the phosphor is even and the appearance is flat.
2, light conversion efficiency is high, stability is good, long life, good anti-aging.
3, can be made with a base and no base, can also be made into thin slices, depending on the implementation conditions and costs. The requirement for the base is colorless, transparent and anti-aging.
4, convenient processing and forming, arbitrary cutting size, low cost.
Another method is to mix the phosphor and the transparent plastic in proportion, and directly produce a phosphor-equipped lampshade through an injection molding machine and a mold, and convert the blue light into white light by the lampshade. This is more convenient and more convenient. Since the lampshade converts the mixed blue light, the white light output has no chromatic aberration, and the light is soft and does not cause glare.
Third, in order to better solve the problem of LED heat dissipation, the design and packaging of the luminaire should be considered together, and the heat sink of the package and the LED heat dissipation should be made into one whole, which effectively reduces the number of thermal resistance, which is very effective and improved. The method of heat dissipation of lamps.
At present, LED fluorescent lamps on the market do not have heat sinks, and such lamps cannot achieve high power and high quality as well as long life. The correct product design should consider the heat sink together. The industrial production is to use the radiator of the LED fluorescent lamp to extrude the semi-circular finned aluminum profile with a die, and then cut the required length according to the power, and then make the same. Aluminum-based copper foil line, the chip is fixed on the copper foil, the gold wire is connected or the helper is used. Such a lamp has a good heat dissipation effect, and has only two thermal resistances, one to two thermal resistances less than the conventional packaging method, which effectively reduces the temperature of the chip, and can play a role in improving the quality and life of the LED fluorescent lamp.
Another method is to design a rib on the aluminum profile, and mill out a number of rectangles according to the need. The ordinary (0.81.0mm thick) pcb circuit board is used to affix or rive the pcb circuit board according to the rectangular opening of the aluminum profile. Combined with the aluminum profile, the LED chip is fixed on the rectangular ledge on the aluminum profile, and the wire on the PCB is connected to the chip by the gold wire. This kind of production process is the best, only one heat resistance, the best heat dissipation effect, manufacturers of LED lamps should give priority to this solution, followed by the method of making copper foil lines on aluminum profiles. Only such innovation can effectively solve the heat dissipation problem of LED long strip lamps, and also improve the quality and life of LED fluorescent lamps.
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