Abstract: Murata Manufacturing Co., Ltd. has developed an evaluation system that enables the assessment of RF ICs, antenna switches, and all components within the RF section. This comprehensive system allows for performance testing of both transmit and receive functions in mobile devices. It also provides technical support for RF component impedance matching challenges faced by customers during the design phase of terminal equipment. The system was showcased at CEATEC JAPAN 2011, held from October 4 to October 8, 2011, at the Makuhari International Convention Center in Chiba, Japan.
Background and Development Purpose: As the development cycle for electronic communication devices like mobile phones continues to shorten, there is a growing demand for miniaturized RF sections and multi-band RF components. To meet these needs, our company leverages its extensive experience in developing RF modules. By integrating these modules into the RF circuit, we can provide tailored solutions to customers after verifying their performance meets the required standards for mobile phone applications.
Features: - Support for Band I, V, IX, (11, 21) quad-band GSM - Board area: 235mm²
Terminology: - RF Part: Refers to the wireless section of the phone - Applications: LTE/W-CDMA/GSM systems
Characteristic Diagram: 3GPP Standard Conformance Test Results
Electrical Characteristics: - 3GPP standard conformance test results
- Ramp Profile and Switching Modulation
The sample price is one million yen, which includes the RF Part Evaluation System Evaluation Board Kit and a set of module data analysis forms.
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