[High-tech Conference] Ruifeng Optoelectronics Xiaoming: Mini-LED trends and challenges in backlighting and display applications

On December 21st and 22nd, 2017, the 2017 High-Tech LED Annual Meeting and Golden Globe Awards Ceremony, hosted by Gaogong LED, took place in Shenzhen Baoan Dunxi Road. The event centered around the theme of “Deepening the Smoke and Softening the Strength, and Deep Integration to Tap New Opportunities.” It was a major gathering that brought together industry leaders and professionals to discuss the future of the LED sector. As one of the most anticipated year-end events in the LED industry, this annual meeting attracted over 400 industry experts and decision-makers. They gathered to explore the latest trends in the LED landscape, including market dynamics, capital flow, technological advancements, and strategies for deep integration. The discussions aimed to uncover new opportunities and solutions for the industry’s next phase of growth, particularly focusing on how companies can achieve a "decisive victory" in a competitive environment. During the opening ceremony of the session titled “Industry Opportunities and Corporate Strategies Focusing on the Chinese Market,” Ruifeng Optoelectronics’ Technical Director, Yan Xiaoming, delivered a keynote speech on the trends and challenges of Mini-LED in backlighting and display applications. His insights were highly valued by attendees who are eager to understand the potential of this emerging technology. An image of Yan Xiaoming was displayed during the event, highlighting his role as a key figure in the development of Mini-LED technology. Jingyuan Optoelectronics has been at the forefront of Mini-LED research and development in Greater China, and Ruifeng has collaborated with them in this field. According to Yan Xiaoming, Ruifeng's goal is to become a leading global technology company. In the LED packaging sector, where competition from larger players like Muliensen is intense, Ruifeng focuses on niche products and continuous innovation. Yan explained that while Micro-LED chips are typically between 30 to 50 microns in size, Mini-LEDs range from 100 to 200 microns. Currently, Mini-LED is mainly used in backlights, not yet commercialized. However, it is seen as a stepping stone toward Micro-LED, which is still considered a distant goal. The industry often refers to Micro-LED as the “500-day challenge,” meaning that within the next 18 months, it will be tested whether it can move toward commercialization. Although there is no current market for Micro-LED, the access point is crucial for future development. Yan believes the best entry points for Mini-LED will be small-to-medium-sized backlights (6 inches or smaller) and large TVs (55 inches or larger). From an indoor perspective, Mini-LED may outperform some existing small-pitch displays in performance. Regardless of whether it's Mini-LED or Micro-LED, the biggest technical challenge lies in the massive transfer process. Each company has its own approach, often kept as a trade secret. The transfer process varies depending on the chip structure—either vertical (with upper and lower electrodes) or flip-chip (coplanar electrode). “Technically, Micro-LED isn’t difficult, but the real challenge lies in choosing the right process route and equipment,” said Xiao Xiaoming. “What we see today is mostly theoretical solutions, but practical equipment is rare. Ruifeng is collaborating with major institutions and enterprises globally, and we have made significant progress.” The event concluded with a strong sense of optimism about the future of LED technology and the role Mini-LED will play in shaping the next generation of displays.

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