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The LTE starting gun is about to "sound". With the expansion of China Mobile's TD-LTE expansion test in many places, the phased construction of the test network in most cities has been completed, the work of 4G commercialization and promotion is in order, and the issuance of LTE licenses is just around the corner, and LTE terminals are starting Migration from data card to smart terminal phone. The industry expects that LTE phones will soon migrate from flagship products to the mass market from the end of this year to the beginning of next year. The external environment is maturing the LTE market day by day. Chip manufacturers have found a sprint "power" and launched mature solutions. It has become a consensus that the pattern is subtly changing.
Multi-mode multi-frequency mature voice solutions to be broken
From a chip perspective, the real challenge still comes from voice solutions, and chip manufacturers need to develop "all-round" chips.
In the LTE era, converging multi-mode and multi-frequency has become a "passport." The most fundamental reason why LTE chips support multi-mode is that LTE deployment cannot cover all places at once, the network layout must be staged, and consumers must provide 2G or 3G voice services, plus 3G itself also has international roaming Needs to support different models. "Compared with 3G, the biggest challenge of LTE is 'multi-frequency'. At present, there are more than 40 frequency bands in the world, and the number is still increasing. This is a great challenge for hardware." Qualcomm Vice President of Product Marketing Yan Chenwei pointed out.
With the accelerated deployment of LTE-FDD around the world, the pressure of China Mobile to implement TD-LTE can be imagined. Chip manufacturers that are naturally sensitive to the market and look forward to gambling on this feast naturally have to offer a weapon of "pacification". At home and abroad, including Qualcomm, Marvell, MediaTek, Spreadtrum, Lianxin, etc., are actively preparing for multi-mode multi-frequency, mass production will be shipped at the end of the year or early next year.
In terms of multi-mode and multi-frequency support, all Qualcomm LTE chips currently support 4G, 3G, or 2G. Zhang Lu, Director of Mobile Products at Marvell mentioned that Marvell PXA1802 can already support 5 modes and 10 frequencies. In the future, more low-end, mid-range, and high-end LTE multi-mode single-chip terminal solution platforms will be launched, and LTE evolution will be supported. Version LTE-A technology. MediaTek also said that it will launch an LTE single-chip solution early next year to meet China Mobile's 5-mode and 10-band requirements; Intel will also launch a next-generation multi-mode multi-band LTE solution, in addition to supporting more frequency bands and higher data rates In addition, support for TD-LTE and TD-SCDMA will be added. Spreadtrum, which has been deeply involved in the LTE field for three years, is developing a second-generation LTE solution. It is expected that in the fourth quarter, a 28nm-based LTE chip will be seen, covering five formats. In 2012, Lianxin Technology, a 4-mode 11-band baseband chip LC1761, was launched. Its assistant to the president Liu Guangjun said that it will launch LTE full-mode products next year to further meet market demand. In addition to supporting full mode, further efforts will be made to enhance chip integration, graphics processing capabilities, and optimized algorithms.
From a chip perspective, technical issues related to LTE chips and reference designs are basically no longer an "obstacle." But for operators, the real challenge still comes from voice solutions. Because LTE only solves the problem of data, it does not solve the problem of voice. Currently, LTE voice solutions include CSFB, dual standby and VoLTE. China Mobile recently announced that it will choose VoLTE as the main voice solution for the TD-LTE network, and plans to start testing in the second half of this year.
However, from the perspective of technology evolution, multi-mode dual standby has the lowest dependence on network deployment and the highest technology maturity, and is a voice technology suitable for the initial stage of LTE deployment. Zhang Lu said that since multi-mode dual standby requires two sets of RF channels, there are costs in terms of cost and power consumption. Although CSFB can improve the cost and power consumption, it needs the optimization of the protocol stack and the comprehensive update of the network equipment, and it takes more time to complete. SRVCC based on IMS technology will be the process of voice towards IP. Finally, VoLTE implements an all-IP voice solution.
"When VoLTE is really applied, it also needs to solve interoperability and interoperability issues, because there are too many different manufacturers, different operations and implementation methods to ensure interoperability and compatibility between devices, whether it is the client or the network Good performance. To solve this problem, operators and equipment manufacturers need to form a unified industry standard in the development of VoLTE. "Zhang Lu further said.
Liu Guangjun also believes that VoLTE requires full support and optimization of terminals, wireless and core networks, which is currently more complicated. In addition, operators need to clarify the relevant service specifications related to VoLTE as soon as possible, so that chip manufacturers can develop accordingly.
Therefore, manufacturers need to be prepared for long-term coexistence, which also requires the chip to become an "all-rounder". MediaTek said it will launch a dual-standby LTE solution and will launch VoLTE chip products. Zhang Lu also pointed out that Marvell's dual connectivity voice solution has been basically mature and commercialized. The CSFB solution is already doing interoperable IOT testing. In addition, VoLTE is also doing interoperable IOT testing. Make a good reserve. Lianxin also said that the VoLTE solution is still under development and is expected to be launched by the end of the year.
Frustration in bidding, domestic manufacturers must take technical measures
To gain a foothold in the market, domestic chip manufacturers also need to improve their independent research and development capabilities and brand influence, improve product performance, increase cooperation, and position themselves to provide an evolved version in the long run.
Around the upcoming LTE feast, the aspiring LTE chip manufacturers are naturally working at full speed. However, among the more than 20 TD-LTE terminal tender models of China Mobile recently, Qualcomm Chip and Marvell two foreign chip manufacturers accounted for 80% of the market share, while domestic chip manufacturers only had a "poor" 20%. In addition to not being selected, the market share occupied by domestic chip manufacturers is also negligible, and the status quo is worrying.
At present, as a pioneer in the field of LTE, Qualcomm has always maintained industry leadership in technological evolution, chip product lineup and commercialization. According to Qualcomm's official introduction, China Mobile released 8 LTE terminals on MWC, most of which use Qualcomm chipsets. Marvell, which is also the first to deploy in the LTE field, currently has TDD, FDD, WCDMA, TD-SCDMA, EGPRS global standard LTE solutions. Although domestic chip makers do not allow much, such as Spreadtrum will expect to launch LTE chips based on 28-nanometer technology in the fourth quarter, and Lianxin Technology is also actively deploying full-mode terminal chips, but for domestic chip manufacturers, the technical issues are not The past hurdles.
Supporting multi-mode and multi-frequency requires deep accumulation in 2G, 3G, and LTE. Domestic chip manufacturers clearly lack technical accumulation and hard power, and their pace is slightly slower, so they lose in this round of "dark war". China Mobile has repeatedly emphasized that TDD / FDD hybrid networking, supporting 5-mode 10-band, 5-mode 12-band and Band 41 are the key points for China Mobile to develop LTE smart terminals. However, domestic chip makers have not yet made good products in this respect, and they have no advantage in "high integration" and "single chip". To gain a foothold in this market, domestic chip manufacturers also need to improve their independent research and development capabilities and brand influence, improve product performance, increase in-depth cooperation with partners, and position themselves to provide evolution versions in the long run.
At present, Qualcomm has even launched a seven-mode full-coverage chip product, which is a real gap. In the LTE industry chain, the future will be the world of full-mode market. After the licensing of 4G, we still have to rely on domestic chip manufacturers to lower the price and expand the scale. At present, Lianxin, Spreadtrum and MediaTek are all in the development of full-mode single-chip products, hoping to achieve their own "legends" by then.
The future pattern of chips is still conjecture
Although 4G is gradually approaching, the glory of 4G belongs to the existing chip manufacturers for how long? Imagine that in the past, the 3G era has become more and more popular, and some have changed, some have redeemed, and some have withdrawn. Some sources pointed out that the amazing disruption effect brought by 3G not only disrupted the previous market share ranking, but also seemed to completely destroy the previous top suppliers Texas Instruments, Motorola / Freescale and Philips / NXP Semiconductors, and STMicroelectronics ’mobile phones. Chip business. In addition, the huge changes in the market share of mobile phone manufacturers have accelerated the demise of established chip manufacturers. Apple ’s iOS and Google ’s Android smartphones have destroyed Nokia, Motorola and Sony Ericsson, undermining the closeness between previous top semiconductor suppliers and mobile phone manufacturers. contact. At the same time, the failure of Japanese mobile phone brands to regain lost ground has accelerated the decline in the revenue of Japanese chip suppliers. This year, LTE chip suppliers Fujitsu (transceivers) and Renesas Technology (baseband and application processors) have failed to obtain enough in Japan. The large scale eventually decided to sell or close its 4G chip business.
Who will be the crown jewel in the new round of competition? From the current point of view, relying on technological advantages, Qualcomm and Samsung accounted for 52% of the smartphone market (iSuppli data), playing a leading role. The manufacturers represented by MediaTek, Marvell and Spreadtrum play the role of market promoters with their own advantages. Of course, the other two powerhouses cannot be ignored: Intel, which relies on the technical advantages of x86 architecture and absolute leading technology, and Broadcom after the recent acquisition of LTE technology-related assets of Renesas Technology Group. Broadcom not only obtained a dual-core LTE system-on-chip, but also obtained a multi-mode multi-band LTE-A / HSPA + / EDGE modem IP. The first multi-mode LTE chip platform will be released early next year. They will play the role of new force.
In view of the dilemma faced by large chip manufacturers in the development of baseband chips, and even the future of Broadcom and the like is not clear, the "turnkey" plan that continues from 2G and 3G should also be "presented" in the 4G era. Processors, RF transceivers, and baseband chips that integrate WiFi, Bluetooth, GPS, FM, and NFC functions must also be provided. The chips of competition among manufacturers continue to increase. The test of technical capabilities, integration capabilities, and resource integration capabilities has continued. The good show of mergers and acquisitions also heralded the subtle ups and downs of the pattern after it was staged.
Who can be boundless in a battle that begins, and who will be wiped out? Some experts analyzed that in the past 10 years, the subversive effect of the rise of 3G / WCDMA technology has caused the cellular chip supply industry to be scattered with the corpses of previous top companies. If the history of the past 10 years can be used for reference, in the next 10 years in the mobile phone chip market, suppliers and technologies may also undergo an amazing reversal. Will history repeat itself?
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