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Xiaomi 6, which has a long-lasting attention, was officially released in Beijing. The standard version is priced at 2499, and the mobile phone price of the 128G memory upgrade version is 2899. This is already the way for Xiaomi to use hunger marketing several times to promote products, as the first domestic autonomy. The smart phone manufacturer that develops the processor, Xiaomi has long dominated the top three in the domestic smart phone market, but as the number of manufacturers in the entire market continues to increase, the cost of publicity continues to increase, and the profit margin becomes smaller.
In 2014, Xiaomi announced that it would cross the line from the smart phone market. Rice cookers, smart bracelets, patch panels, notebooks and other industries are everywhere. Although this “no business†approach makes many “fever†powders dissatisfied, Lei Jun is aware of his keen eye. In the next few years, the market competition for smart phones will become more and more fierce, and the grab of profits will decline with rising costs.
Multi-industry blossoms, quickly gathered to a large number of rice noodles, the brand's promotion effect is also significant, but as the leader of the Internet era, Lei Jun's vision quickly focused on India, overseas countries.
It is reported that last year, Xiaomi pressed foreign famous and unknown brands and became the first product in India's annual sales list.
As the top three countries in the world, Xiaomi has undoubtedly found a huge smartphone market.
This time, the Xiaomi 6 conference, Lei Jun is the carrier's latest flagship product of the world's top processor Snapdragon 835, zoom double camera and four curved surface design to expand overseas results.
In the era of smart phone flooding, Xiaomi 6 not only adopts the latest, best, and most cost-effective configuration in software, but also adopts the design of ceramic surface on the hardware, which is more beautiful and generous.
Xiaomi has adopted the design and application of integrated circuit packaging in electronic component packaging. At present, the cutting-edge technology in the integrated circuit packaging market is the application of ceramic packaging, which can not only handle larger power, but also adapt to higher losses, and is also a mobile phone. The compact and convenient design provides the foundation.
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