Cob light source

COB light sources have become a widely recognized product category in the lighting industry. While many brands now offer COB technology, there are still many people who are not familiar with what it actually means. Today, we’ll take a closer look at this innovative lighting solution and explain its significance.

COB stands for "Chip on Board," a packaging technology that involves directly mounting multiple LED chips onto a single substrate, creating an integrated surface light source. This method eliminates the need for traditional packaging components, offering a more compact and efficient design.

COB packaging is a well-established technique in the LED industry, and its use has grown significantly as LED technology becomes more mainstream. It's particularly popular in applications where high performance and reliability are essential.

The COB light source uses a high-reflection mirror metal substrate to attach LED chips directly, which helps improve efficiency and reduce manufacturing steps. By eliminating processes like electroplating and reflow soldering, the overall production time and cost are significantly reduced.

This technology allows for greater flexibility in designing the light-emitting area and shape of the light source, making it ideal for custom lighting solutions. It's often used in applications where uniform illumination and high-quality light output are required.

Key Features:

- Cost-effective and easy to integrate

- Stable electrical performance with optimized thermal and optical design

- Excellent heat dissipation ensures high lumen maintenance (up to 95%)

- Supports advanced optical matching, improving lighting quality

- Produces smooth, even light with no hot spots, promoting a healthier environment

- Easy installation and reduced design complexity, lowering long-term maintenance costs

Main Products:

There are two primary bare chip technologies: COB and Flip Chip. In COB packaging, the semiconductor chip is mounted directly onto a printed circuit board, with electrical connections made via wire bonding and sealed with resin for enhanced durability.

Primary Applications:

COB light sources are commonly used indoors for spotlights, downlights, ceiling lights, and light strips. They are also widely applied outdoors in street lights, high-bay lights, floodlights, and architectural lighting.

In addition, they are used in luminous signs, decorative lighting, and other commercial and residential applications where consistent and high-quality lighting is needed.

Manufacturing Process:

The COB process begins by applying a thermally conductive epoxy resin (often mixed with silver particles) to the substrate. The silicon wafer is then placed directly onto the surface, and heat treatment is used to secure it. Finally, wire bonding creates the necessary electrical connections between the chip and the substrate.

Advantages of COB:

From a cost perspective, COB modules can reduce package costs, light engine fabrication costs, and secondary optical system expenses. Overall, the cost savings can be up to 15% compared to traditional discrete LED systems.

In terms of performance, COB technology avoids issues like glare and hot spots that are common in point-source LEDs. With proper red chip integration, it enhances color rendering, achieving values over 90.

COB also simplifies the design and production of lighting fixtures, making installation faster and more efficient. Existing manufacturing equipment can support mass production of high-yield COB modules with ease.

As a fourth-generation lighting technology, COB represents a significant evolution from traditional LED packaging. Unlike conventional surface-mounted LEDs, COB integrates the chip directly onto the board, resulting in a more compact and efficient light source.

Compared to point-source LEDs, COB light sources cover a much larger surface area while generating less heat—reducing energy consumption by 5–10 times. This makes them ideal for applications requiring long-lasting, energy-efficient lighting.

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